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          PCB Design: Basics of Control Impedance

          2017-04-07

          With signal switching frequencies getting higher these days, impedance within tracks of Printed Circuit Boards has become an issue for modern day PCB designers.

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          Bill of Materials Example for PCB Assembly

          2017-03-03

          Bittele Electronics requires a bill of materials (BOM prior to the commencement and scheduling of a PCB assembly order.

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          PCB Fabrication BGA Prototyping Boards

          2017-03-03

          Bittele Electronics utilizes sophisticated equipments to assemble BGA prototyping boards. We have 8 years of experience in BGA assembly, BGA rework services.

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          Basic Factors in PCB Design

          2017-03-03

          Various key factors have to be kept in mind while designing a PCB for a quality design. An important principle of PCB design, which becomes more critical in mixed signal design in order to avoid noisy signals and abnormal functioning is keeping analogue a

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          6 Steps for Creating an Electronic Design Schematic

          2017-02-28

          Electronics design engineers perform many different tasks to take their ideas from the breadboard to the PCB assembly house. But one of the most important tasks they need to do is to create a schematic drawing.

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          An Analysis of SMT Solder Paste Printing Defects

          2017-02-28

          In SMT PCB production, solder paste printing is a critical step. Since the solder paste is used to directly form the soldering joint, the quality of solder paste printing affects the performance and reliability of the surface mount assembly.

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          Shenzhen Grande Electronic offers Ball Grid Array (BGA) assembly

          2017-02-28

          Shenzhen Grande Electronic Inc. is a renowned EMS provider. It is capable of doing fine pitch assemblies that have less than 0.5 mm pitch. Grande has been doing BGA soldering for a long time and it offers x-ray inspection for BGA soldering.

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          PCB assembly Ball Grid Array Inspection - Shenzhen Grande Electronic

          2017-02-28

          Ball Grid Array (BGA) assembly is relatively newer, more sophisticated technique which is gradually replacing the Dual-In line-Package technique (DIP) or conventional flat packaging techniques.

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          国产国产人在线成免费视频

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