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          An Analysis of SMT Solder Paste Printing Defects

          2017-02-28

          In SMT PCB production, solder paste printing is a critical step. Since the solder paste is used to directly form the soldering joint, the quality of solder paste printing affects the performance and reliability of the surface mount assembly.

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          Shenzhen Grande Electronic offers Ball Grid Array (BGA) assembly

          2017-02-28

          Shenzhen Grande Electronic Inc. is a renowned EMS provider. It is capable of doing fine pitch assemblies that have less than 0.5 mm pitch. Grande has been doing BGA soldering for a long time and it offers x-ray inspection for BGA soldering.

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          PCB assembly Ball Grid Array Inspection - Shenzhen Grande Electronic

          2017-02-28

          Ball Grid Array (BGA) assembly is relatively newer, more sophisticated technique which is gradually replacing the Dual-In line-Package technique (DIP) or conventional flat packaging techniques.

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          国产国产人在线成免费视频

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